AI HARDWARE DATABASE
AI Hardware Directory · Page 21 of 21 (183 Verified Devices)
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PAGINATED HARDWARE DIRECTORY · PAGE 21 OF 21

AI Hardware Specification Database

Showing devices 181–183 of 183 lab-benchmarked physical AI products.

Hello Robot In Stock
Embodied AI & Robotics · 24.5kg 33×34cm · 1.1m Mast + 52cm Arm · Open VLA

Hello Robot Stretch 3 24.5kg 141cm Prismatic-Mast, Dual-RealSense & Open-Source ROS 2 / LeRobot Mobile Manipulator

24.5-kilogram, 141cm-tall lightweight mobile manipulator engineered on a 33×34cm human-width differential-drive base—combining a 1.10-meter vertical lift mast, 52cm telescoping carbon-fiber prismatic arm, 3-DoF Dex Wrist 3 compliant gripper (2.0kg payload), dual Intel RealSense RGB-D cameras (head D435i + wrist D405), 2D LiDAR, Intel 12th-Gen Core i5 NUC12, and 100% open-source Python / ROS 2 / LeRobot VLA software.

Silicon / SoC Intel NUC 12 Pro (12th-Gen Intel Core i5-1240P 12-Core CPU, 16GB DDR4 RAM, 500GB NVMe SSD) Running Ubuntu 22.04 + ROS 2 Humble
AI Model Open-Source Embodied AI & VLA Stack Supporting Hugging Face LeRobot, Diffusion Policy, HomeRobot, MoveIt 2 & WebRTC Teleop
Weight 24.5kg (54 lbs) Intrinsically Safe Lightweight Frame (33 × 34 × 141cm; Easily Lifted into a Car Trunk by One Person)
Battery Internal Rechargeable Sealed Lead-Acid / LiFePO4 Option Delivering 2.0–5.0 Hours Untethered Manipulation + Smart Charger
$24,950 ★ 4.9
Specs →
Qualcomm In Stock
Edge Compute & DevKits · $399 Vision Kit · QCS6490 12-TOPS · Dual MIPI Cams

Qualcomm Dragonwing RB3 Gen 2 Vision Development Kit ($399 QCS6490 12-TOPS Hexagon NPU, Triple ISP & Dual-Cam)

$399 (~200g) official Qualcomm Dragonwing QCS6490 robotics and edge-vision development kit pairing an 8-core 6nm Kryo 670 CPU, 12-TOPS Hexagon 770 Tensor NPU, Adreno 643L GPU, and Triple 14-bit Spectra ISP with an integrated Vision Mezzanine (12MP Sony IMX577 main camera + global-shutter OV9282 tracking camera), Wi-Fi 6E, Gigabit Ethernet, and Qualcomm Linux / ROS 2 / AI Hub support.

Silicon / SoC Qualcomm Dragonwing QCS6490 6nm SoC (1× Kryo 670 Prime @ 2.7GHz + 3× Gold @ 2.4GHz + 4× Silver @ 1.9GHz + Adreno 643L GPU)
AI Model 12.0 Dense INT8 TOPS (6th-Gen Hexagon 770 NPU w/ fused Tensor/Vector/Scalar Accel) Running Qualcomm AI Hub, ONNX & TFLite
Weight ~200.0g Stacked Mainboard + Vision Mezzanine Assembly (~100 × 85mm Modular 96Boards-Derived Industrial Footprint)
Battery 12V DC Barrel Input + Ultra-Low-Power 6nm Mobile-Derived Thermal Envelope Ideal for LiPo-Powered Drones & Rovers
$399 ★ 4.8
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Khadas In Stock
Edge Compute & DevKits · 25g 5.7mm SBC · RK3588S2 6-TOPS · 16GB + 4× Display

Khadas Edge2 Pro ($239 25g 5.7mm Ultra-Thin RK3588S2 6-TOPS NPU, 16GB LPDDR4X & Quad-Display SBC)

$239, 25-gram (82×57.5×5.7mm bare PCB / ~70g Maker Kit) ultra-thin credit-card single-board computer powered by the 8nm Rockchip RK3588S2 (4× Cortex-A76 + 4× Cortex-A55 + 6.0-TOPS triple-core NPU)—packing 16GB 64-bit LPDDR4X, 64GB eMMC 5.1, AP6275P PCIe Wi-Fi 6, 3× MIPI CSI camera FPCs, 4× independent display outputs (up to 8K60), an STM32 power-management MCU, and embedded OOWOW cloud OS installation.

Silicon / SoC 8nm Rockchip RK3588S2 (4× Cortex-A76 @ 2.25GHz + 4× Cortex-A55 @ 1.8GHz + Quad-Core Mali-G610 MP4 GPU + STM32G031 Boot MCU)
AI Model 6.0 TOPS Triple-Core NPU (INT4/INT8/INT16/FP16) Running RKNN-LLM (1.5B–3B Quantized LLMs), YOLOv8 & Multi-Stream 8K VPU
Weight 25.0g Bare PCB (82.0 × 57.5 × 5.7mm; ~70g w/ Active Cooling Heatsink & Maker Kit Enclosure)
Battery 5V–20V USB Type-C PD Power Input + Pogo-Pin & FPC Battery/IO Headers Managed by Dedicated STM32 Low-Power Controller
$239 ★ 4.7
Specs →