AI HARDWARE DATABASE
AI Hardware Directory · Page 11 of 11 (93 Verified Devices)
PAGINATED HARDWARE DIRECTORY · PAGE 11 OF 11

AI Hardware Specification Database

Showing devices 91–93 of 93 lab-benchmarked physical AI products.

MagicLab (Magic Atom) Pre-Order
Embodied AI & Robotics · 42 DoF · 20kg Dual-Arm Payload

MagicLab MagicBot Gen1 42-DoF Industrial Bimanual Humanoid Robot

174cm, 67.5kg general-purpose industrial bipedal humanoid engineered with 42 active Degrees of Freedom, 350 N·m in-house QDD actuators, dual 11-DoF Magic-Hand tactile dexterous hands, and 20kg dual-arm payload capacity for factory assembly.

Silicon / SoC 8-Core Real-Time Industrial CPU + 100+ TOPS Embedded AI Perception Accelerator
AI Model MagicLab Multi-Agent Factory Fleet VLA + Sim-to-Real Whole-Body Locomotion Control
Weight 67.5kg (174cm Standing Height / 42 Active DoF Including Dual 11-DoF Dexterous Hands)
Battery Hot-Swappable 48V Industrial Battery Pack (Up to 4h Continuous Factory Manipulation)
HP × AMD In Stock
Edge Compute & DevKits · 128GB Unified · 96GB UMA VRAM

HP Z2 Mini G1a Workstation (Ryzen AI Max+ PRO 395 128GB Unified)

2.9-liter enterprise mini workstation powered by the 16-core AMD Ryzen AI Max+ PRO 395 (Zen 5 + 40-CU Radeon 8060S + 50-TOPS XDNA 2 NPU) with 128GB 8533 MT/s LPDDR5X unified memory and up to 96GB dedicated VRAM allocation for local 70B+ LLMs.

Silicon / SoC AMD Ryzen AI Max+ PRO 395 (16× Zen 5 Cores @ 5.1GHz + 40-CU Radeon 8060S + 50-TOPS XDNA 2 NPU)
AI Model Local Llama-3.3-70B, DeepSeek-R1-Distill-70B & Qwen-72B via ROCm 6.4, Vulkan, llama.cpp & LM Studio
Weight 2.3kg (211 × 218 × 69mm / 2.9-Liter Chassis w/ Internal 300W 92%-Efficient Power Supply)
Battery Internal 300W PSU (Configurable 45W–120W+ Sustained APU cTDP w/ Phase-Change Cooling)
ASUS × NVIDIA In Stock
Edge Compute & DevKits · 1,000 FP4 TOPS · 200GbE ConnectX-7

ASUS Ascent GX10 Desktop AI Supercomputer (NVIDIA GB10 128GB)

Compact desktop AI supercomputer built on the NVIDIA GB10 Grace Blackwell Superchip (20-core Arm CPU + Blackwell GPU via 900 GB/s NVLink-C2C), delivering 1,000 FP4 TOPS (1 PFLOP) with 128GB unified LPDDR5X and dual 200GbE ConnectX-7 clustering.

Silicon / SoC NVIDIA GB10 Grace Blackwell Superchip (20-Core Arm v9.2 CPU + 5th-Gen Tensor Blackwell GPU)
AI Model Up to 200B Parameter Local LLMs (Single Node) or 405B Parameter Models (2-Node ConnectX-7 Cluster)
Weight 1.25kg (150 × 150 × 51mm Custom ASUS Dual-Fan Vapor-Chamber CNC Enclosure)
Battery 180W–240W USB-C PD External Power Adapter (~140W Peak GB10 Superchip Envelope)